半导体材料的生产

Mo(CO)6

Molybdenum hexacarbonyl
C6MoO6
CAS Number 13939-06-5 IUPAC Name Molybdenum hexacarbonyl Molecular Formula C6MoO6 Average Mass 264.01
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MoOCl4

Molybdenum(VI) tetrachloride oxide
MoOCl4
CAS Number 13814-75-0 IUPAC Name Molybdenum(VI) tetrachloride oxide Molecular Formula MoOCl4 Average Mass 253.78
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MoO2Cl2

Molybdenum(VI) dichloride dioxide
MoO2Cl2
CAS Number 13637-68-8 IUPAC Name Molybdenum(VI) dichloride dioxide Molecular Formula MoO2Cl2 Average Mass 198.84
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TDMAS (99.999% - Si)

N,N,N',N',N'',N''-Hexamethylsilanetriamine
[(CH3)2N]3SiH
CAS Number 15112-89-7 IUPAC Name N,N,N',N',N'',N''-Hexamethylsilanetriamine Molecular Formula [(CH3)2N]3SiH Average Mass 161.32
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TEOS (99.999999% - Si)

Tetraethyl orthosilicate
C8H20O4Si
CAS Number 78-10-4 IUPAC Name Tetraethyl orthosilicate Molecular Formula C8H20O4Si Average Mass 208.33
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SiI4 (99.999% - Si)

Silicon tetraiodide
SiI4
CAS Number 13465-84-4 IUPAC Name Silicon tetraiodide Molecular Formula SiI4 Average Mass 535.7
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BTBAS (99.999% - Si)

Bis(t-butylamino)silane
C8H22N2Si
CAS Number 186598-40-3 IUPAC Name Bis(t-butylamino)silane Molecular Formula C8H22N2Si Average Mass 174.36
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